Responsibilities:
Execute thermal design and simulation for high-speed networking components, focusing on Co-Packaged Optics (CPO) and ASIC-optics integration within high power density environments.
Lead the end-to-end development of thermal solutions, including direct liquid cooling (DLC), cold plates, CDU, and heat exchangers
Use CFD tools (FloTherm or Macroflow) to perform rack and system-level thermal/fluid analysis (flow distribution, pressure drop, and temperature profiling)
Design thermal components using 3D CAD (Creo or SolidWorks) to support seamless hardware integration
Execute thermal, liquid, and acoustic validation testing; lead root cause analysis (RCA) for flow or thermal issues and implement corrective designs
Collaborate with ME/EE/Reliability and global vendors to align thermal architectures with total system design and international standards
Basic Requirements:
Bachelor's or Master's Degree in Mechanical/Thermal Engineering and 8+ years total experience in product design (Server, Networking switch)
Proven experience in the thermal management of high-power ASICs and advanced packaging, with specific exposure to CPO or Silicon Photonics
3+ years of specific experience in rack-scale thermal design
Hands-on experience with heat pipes, vapor chambers, fans, and liquid cooling components
Proficiency in CFD simulation and 3D modeling software
Excellent English communication skills (verbal and written) with strong technical leadership capabilities
Desirable Requirements:
Self-motivated and proactive
Fluent in English language (verbal and written)
Responsibilities:
Define and support thermal architecture for high-speed networking systems incorporating advanced packaging technologies such as Co-Packaged Optics (CPO), including thermal considerations for ASIC-optics integration and high power density environments.
Capable to own the rack-level liquid cooling architecture, including CDU, rack manifold, loop flow balancing, and redundancy budgeting.
Influence the integration of thermal strategy into the overall system architecture, ensuring alignment with technology roadmaps.
Identify and evaluate new technologies, innovations, and outsourced partner relationships for alignment with the technology roadmap.
Use CFD tools (FloTherm, Macroflow) to drive optimized thermal solutions balancing thermal and power requirements.
Define rack-level validation strategies, including qualification scope, test coverage, and success criteria, proving correlation between simulation and test data.
Lead thermal development activities, providing design guidance and methodologies to less-experienced staff members.
Effective communication of complex product architectures and design proposals to executive levels and cross-functional teams.
Basic Requirements:
Bachelor's or Master's Degree in Mechanical/Thermal Engineering and 12+ years total experience in product design (Server, Networking switch)
Proven experience in the thermal management of high-power ASICs and advanced packaging, with specific exposure to CPO or Silicon Photonics
5+ years specifically in rack-level or datacenter liquid cooling
Deep understanding of rack-level systems: CDU operation, flow balancing, redundancy, and serviceability
Advanced proficiency in FloTherm, Macroflow, or equivalent for CFD analysis
Expertise in 3D CAD (Creo or SolidWorks)
Excellent English communication skills (verbal and written) with strong technical leadership capabilities
Desirable Requirements:
Self-motivated and proactive
Fluent in English language (verbal and written)
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Jabil, including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, sexual orientation, gender identity, age, disability, genetic information, veteran status, or any other characteristic protected by law.
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