What a College Intern - Process and Digitalization does at HP:

• Collaborate with the engineering team to develop solutions in our manufacturing operation using AI, IIOT, Smart vision system and/or other automation solutions. 
• Practical work with on very high speed/high precision die attach equipment, wire bonder, chip attach, high precision over-mold tool and other semiconductor packaging tools in High Volume manufacturing environment.  
• Participates in concurrent projects on current production, sustainability and New Product Introduction. 
• Work alongside an aspiring team of Engineering and Operation executives to build smart factory solutions to future-proof the manufacturing quality of our supplies. 
• Innovates, develops and defines improved manufacturing processes through methodical approach and studies. 

Individuals who do well in this role at HP, usually possess:

• Master or Bachelor's degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI or any related field. 
• Able to commit for a 5-6 months full time internship, starting in January 2027.
• A willingness to learn and the ability to communicate ideas clearly in a team. 
• Strong ability to work as team and as individual. 
• Practical and smart thinking to turn a typical MNC operations into an exciting workplace through implementation of smart technology. 
• Applied Skill with Power BI, Power Automate and/or Robotic Process Automation would be an advantage. 
• Good knowledge and applied skills in AI, IIOT, digitalization, Machine Learning and/or software programming skills would be an added advantage.

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Sustainable impact is HP's commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision - to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner - we commit to human capital development and adopting progressive workplace practices in Singapore.

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